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Wayne D. Kaplan
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- Haifa
- Israel
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Interface Science
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A forum for people working on interface science, and interested in promoting publications on the same.
A forum for people working on interface science, and interested in promoting publications on the same.
A place for discussing the pedagogy of materials science
ICSMA, ICAM, MS&T, MRS... Post perspective, reactions, comments, thoughts here...
A forum for people working on interface science, and interested in promoting publications on the same.
A good point, but I no longer believe in 'clean' surfaces or interfaces. The real question (after you clean it) is WHAT is there as a residue, and if you can't detect it, then what is the detection limit.
Too many works state that X was not detecte…
A forum for people working on interface science, and interested in promoting publications on the same.
Profile Information
- What is your main area of research?
- Interfaces: thermodynamics, structure, chemistry, stability
- Which sub-disciplines do you work in?
- Other
- Of which professional societies are you a member?
- Other
- Have you previously published with the JMS? If yes, what?
- T. Cohen-Hyams, J.M. Plitzko, C.J.D. Hetherington, J.L. Hutchison, J. Yahalom, and W.D. Kaplan, Microstructural Dependence of Giant-Magnetoresistance in Electrodeposited Cu-Co Alloys, Journal of Materials Science, 39:5701-5709, 2004.
G. Levi and W.D. Kaplan, The Influence of Interfacial Wetting and Adhesion on the Formation of Voids at Metal-Ceramic Interfaces, Journal of Materials Science, 41[3]: 817-821, 2006.
H. Sadan and W.D. Kaplan, Au-Sapphire (0001) Solid-Solid Interfacial Energy, Journal of Materials Science, 41[16]: 5099-5107, 2006.
H. Sadan and W.D. Kaplan, Morphology and Orientation of the Equilibrated Au-Sapphire (10-10) Interface, Journal of Materials Science, 41[16]: 5371-5375, 2006.
M. Baram and W.D. Kaplan, Intergranular Films at Au-Sapphire Interfaces, Journal of Materials Science, 44[23]:7775-7784, 2006.
A. Karpel, G. Gur, Z. Atzmon, and W.D. Kaplan, TEM Microstructural Analysis of As-Bonded Al-Au Wire-Bonds, Journal of Materials Science, 42[7]: 2334-2346, 2007.
A. Karpel, G. Gur, Z. Atzmon, and W.D. Kaplan, Microstructural Evolution of Gold-Aluminium Wire-Bonds, Journal of Materials Science, 42[7]: 2347-2357 , 2007.
M. Drozdov, G. Gur, Z. Atzmon and W. D. Kaplan, Detailed investigation of ultrasonic Al–Cu wire-bonds: I. Intermetallic formation in the as-bonded state, Journal of Materials Science, 43[18]:6029-6037, 2008.
M. Drozdov, G. Gur, Z. Atzmon and W. D. Kaplan, Detailed investigation of ultrasonic Al–Cu wire-bonds: II. Microstructural evolution during annealing, Journal of Materials Science, 43[18]:6038-6048, 2008.
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